VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V, +8 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, VDD +0.3 V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, +8 V
VOUT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V, VDD+ 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . . . . . . . . (TJ MAX- TA)/JA
Thermal Resistance JA
8-Lead Plastic DIP Package (N-8) . . . . . . . . . . . . . . . . . . . . 103°C/W
8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . . . . . . . . . 158°C/W
TSSOP-8 Package (RU-8) . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C/W
Maximum Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . -150°C
Operating Temperature Range . . . . . . . . . . . . . . . . . -40°C to +85°C
AD7391AR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . . . . . . -300°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability.
Required Field 
